紧物理热载体降解模型在广泛的偏差范围内有效
Stanislav Tyaginov1, Erik Bury1, Alexander Grill1
1Imec, Kapeldreef 75, 3001 Leuven, Belgium.
Micromachines
|November 25, 2023
概括
我们为热载体降解 (HCD) 创建了一个紧的物理模型,可以准确地预测各种门和排水电压的设备行为. 该模型强调二次载体冲击电离,这对于在特定压力条件下理解HCD至关重要.
科学领域:
- 半导体设备物理学 半导体设备物理
- 可靠性工程可靠性工程
- 材料科学是一种材料科学.
背景情况:
- 热载体降解 (HCD) 是半导体设备的关键可靠性问题.
- 现有的模型可能无法完全捕捉HCD在不同的操作条件下,特别是二次载体的作用.
- 了解HCD机制对于设计强大且持久的电子元件至关重要.
研究的目的:
- 为热载体降解 (HCD) 开发一个紧而准确的基于物理的模型.
- 将通过冲击电离生成的二次载体的显著贡献纳入HCD模型.
- 为了确保模型在一个广泛的门 (Vgs) 和排水 (Vds) 电压范围内的有效性.
主要方法:
- 为载体运输开发精细的物理模型,同时考虑主要和次要载体.
- 整合冲击电离机制以建模二次载体生成.
- 使用造品质的n通道晶体管在广泛的应力电压 (Vgs,Vds) 下进行实验验证.
主要成果:
- 开发的紧物理模型在广泛的Vgs和Vds中证明了其有效性.
- 该模型准确地捕捉了二次载体对HCD的重大贡献,特别是在低Vgs和高Vds压力条件下.
- 实验数据证实了该模型对热载体降解的预测能力.
结论:
- 新的紧物理模型为热载体降解提供了更全面的理解.
- 对二次载体的准确建模对于在各种应力条件下预测半导体设备可靠性至关重要.
- 这个模型可以帮助设计更强大,更可靠的半导体设备.
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