一个高性能的InGaAs垂直电子孔双层道场效应晶体管,带有P+-Pocket和InAlAs块
Hu Liu1, Peifeng Li1, Xiaoyu Zhou1
1School of Electronic and Information Engineering, Lanzhou Jiaotong University, Lanzhou 730070, China.
Micromachines
|November 25, 2023
概括
一个新的InGaAs垂直电子孔双层道场效应晶体管 (EHBTFET) 具有P+口袋和AlGaAs块显著提高了性能. 这种设计增强了状态上的电流,并减少了状态外的电流,提高了设备的效率.
科学领域:
- 半导体设备物理学 半导体设备物理
- 材料科学是一种材料科学.
背景情况:
- 传统的InGaAs垂直电子孔双层道场效应晶体管 (EHBTFET) 在芯片密度和设备性能方面面临挑战.
- 优化制造工艺的无毒的InGaAs通道和管理道电流对于先进的晶体管至关重要.
研究的目的:
- 引入和系统地研究一个新的InGaAs垂直电子孔双层道场效应晶体管 (VPB-EHBTFET),其中包含一个P+口袋和一个InAlAs块.
- 通过优化VPB-EHBTFET的关键结构参数来提高芯片密度和设备性能.
主要方法:
- 技术计算机辅助设计 (TCAD) 模拟用于系统的设备研究.
- 对P+口袋宽度/兴奋剂和InAlAs块长度/宽度进行了优化.
主要成果:
- 该VPB-EHBTFET实现了超低的状态下电流1.83 × 10^-19 A/μm和高的状态下电流1.04 × 10^-4 A/μm.
- 获得了平均5.5mV/dec的下值波动,与传统设备相比减少了81.8%.
- 该设备显示了显著减少的状态下电流 (数量级的三次下降) 和增加的状态下电流 (六倍以上).
结论:
- 拟议的VPB-EHBTFET设计有效地抑制了点道,并促进了孔反向层的形成.
- 优化的设备表现出卓越的性能指标,包括减少状态外电流,增强状态内电流和改进的下值摆动.
- 这些进步显著提高了EBHTFET在高性能集成电路中的实际应用.
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