Jove
Visualize
联系我们
JoVE
x logofacebook logolinkedin logoyoutube logo
关于 JoVE
概览领导团队博客JoVE 帮助中心
作者
出版流程编辑委员会范围与政策同行评审常见问题投稿
图书馆员
用户评价订阅访问资源图书馆顾问委员会常见问题
研究
JoVE JournalMethods CollectionsJoVE Encyclopedia of Experiments存档
教育
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab Manual教师资源中心教师网站
使用条款与条件
隐私政策
政策

相关概念视频

Semiconductors01:22

Semiconductors

708
There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
708
Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

353
The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
353
Non-ohmic Devices00:51

Non-ohmic Devices

1.1K
In most substances, the current flow is proportional to the voltage applied to it. A simple relationship between the values of current, voltage, and resistance is known as Ohm's law. Nonohmic devices do not exhibit a linear relationship between voltage and current. One such device is the semiconducting circuit element known as a diode. A diode is a circuit device that allows current flow in only one direction.
Consider a simple circuit consisting of a battery, a diode, and a resistor. A...
1.1K

您也可能阅读

相关文章

通过共同作者、期刊和引用图与本文相关的文章。

排序
Same author

Targeting astrocyte-mediated neurotoxicity induced by ALS/FTD-associated RNA binding proteins.

Cell communication and signaling : CCS·2026
Same author

LPIN2 contributes to tyrosine kinase inhibitor resistance via activation of PI3K pathway.

Translational lung cancer research·2026
Same author

Cross-disease LC-MS/MS plasma proteomics identifies reproducible shared and disease-enriched biomarker signatures in neurodegenerative disorders.

Acta neuropathologica communications·2026
Same author

Establishment and characterization of TRI-LC21: a novel patient-derived cell line of SMARCA4-deficient undifferentiated thoracic tumor.

Human cell·2026
Same author

A telomerase-SUCLG2 signaling axis drives drug resistance by protecting persister cells.

Cell reports·2026
Same author

Gene therapy for spinocerebellar ataxias.

Trends in pharmacological sciences·2026

相关实验视频

Updated: Jul 9, 2025

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
11:09

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

10.2K

基于二维材料的电子产品的单立体3D集成,以实现最终的边缘计算解决方案.

Ji-Hoon Kang1,2,3, Heechang Shin4, Ki Seok Kim1,2

  • 1Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA, USA.

Nature materials
|November 27, 2023
PubMed
概括

研究人员开发了一种新的单立体3D集成技术,用于人工智能 (AI) 硬件. 这种方法堆叠了基于二维材料的层,使得高度集成和多功能AI处理系统成为可能.

更多相关视频

Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

37.2K
A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
07:12

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

9.7K

相关实验视频

Last Updated: Jul 9, 2025

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
11:09

Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

Published on: June 23, 2017

10.2K
Planar and Three-Dimensional Printing of Conductive Inks
10:49

Planar and Three-Dimensional Printing of Conductive Inks

Published on: December 9, 2011

37.2K
A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics
07:12

A Standard and Reliable Method to Fabricate Two-Dimensional Nanoelectronics

Published on: August 28, 2018

9.7K

科学领域:

  • 材料科学 材料科学 材料科学
  • 电气工程 电气工程
  • 计算机科学 计算机科学

背景情况:

  • 三维 (3D) 异构集成在电子领域提供了高密度和多功能性.
  • 传统的3D集成面临着复杂的处理和布线的挑战.

研究的目的:

  • 展示基于二维材料的AI处理硬件的单体3D集成.
  • 在人工智能系统中实现最终的整合性和多功能性.

主要方法:

  • 垂直集成的六层晶体管和memristor阵列成一个3D纳米系统.
  • 利用AI处理层的剥离和堆叠,这些层是从自下而上的2D材料合成的.

主要成果:

  • 实现了一个完全单体的3D集成AI系统.
  • 证明减少了处理时间,电压下降,延迟和足迹.
  • 启用了人工智能处理层中的密集层间连接.

结论:

  • 这种单体3D集成为电子异质集成提供了材料层面的解决方案.
  • 为增强并行性的多功能计算硬件铺平了道路.