表面的低温被动化,以提高Schottky屏障MOSFET的性能
Joel Molina-Reyes1, Adriana Mercedes Cuellar-Juarez2
1Instituto Nacional de Astrofísica, Óptica y Electrónica (INAOE), Electronics Department. Luis Enrique Erro #1, Santa María Tonantzintla, C.P. 72840, Puebla, Mexico.
Nanotechnology
|November 30, 2023
概括
研究人员使用低热预算 (100°C) 和新的被动化技术开发了一种Schottky屏障MOSFET. 这种金属/半导体接口被动化使高性能晶体管与标准CMOS工艺兼容.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
- 电气工程 电气工程
背景情况:
- 标准的MOSFET面临着扩展和功率效率方面的挑战.
- 施托基屏障设备提供了性能改进的潜力,但需要仔细的界面工程.
研究的目的:
- 使用低热预算工艺开发一个具有低下值斜率的Schottky屏障MOSFET.
- 为了研究接口被动化对设备性能的影响.
主要方法:
- 使用了简单的设备架构和工艺设计,最高热预算为100°C.
- 化金属/接口与超薄氧化 (SiOx) 薄膜.
- 用于的e-beam蒸发和氧化物 (HfO2) 门氧化物的原子层沉积.
主要成果:
- 在Schottky屏障MOSFET中实现了70mV dec-1的低下值斜率.
- 在金属/和氧化物/接口的缺陷密度通过末制造配方将缺陷密度降至最低.
- 保持了Schottky屏障高度,导致了出色的晶体管性能.
结论:
- 一个低热预算的工艺使得高性能Schotky屏障MOSFET的制造成为可能.
- 开发的设备兼容标准CMOS处理,可以集成到集成电路中.
- 在需要低热预算应用的集成电路中增强功能的潜力.
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