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酸盐度对Au或Cu结合线和半导体包装的结合之间的腐蚀行为的影响

Young-Ran Yoo¹, Gyubinn Kim², Sung-Min Jeon³

¹Materials Research Centre for Energy and Clean Technology, Andong National University, 1375 Gyeongdong-ro, Andong 36729, Republic of Korea.

Materials (Basel, Switzerland)

|December 9, 2023

概括

这项研究研究了金 (Au) 和铜 (Cu) 线在 (Al) 粘合上结合的电腐蚀. 盐酸度增加会加剧腐蚀,影响半导体的可靠性.

科学领域:

材料科学材料科学材料科学
电化学电化学电化学
半导体制造业半导体制造业

背景情况:

电线结合是一种使用Au,Cu或Ag电线的关键半导体互连技术.
环氧成型化合物 (EMC) 由于固有的离子和吸收水分,可以创造腐蚀性环境.
了解腐蚀对于确保半导体设备的长期可靠性至关重要.

研究的目的:

为了评估盐酸度对线材粘合材料和粘合之间的电腐蚀的影响.
分析控制这种腐蚀过程的电化学因素.
评估印刷电路板 (PCB) 单元在不同区域的腐蚀倾向.

主要方法:

对金 (Au) 和铜 (Cu) 粘接线与 (Al) 粘接的电化学分析.
对不同酸度的研究.
测量腐蚀潜力差异 (ΔE),电腐蚀电流密度 (i_g) 和Tafel斜率.

主要成果:

盐酸度显著影响了电腐蚀的行为.
电化学参数,如ΔE,i_g,以及Tafel斜率是腐蚀的关键指标.
在PCB标本的第一键和第二键区域中观察到电腐蚀.

结论:

盐酸的度是电线结合物的电腐蚀的一个关键因素.
电化学测量为腐蚀机制提供了宝贵的见解.
腐蚀缓解策略是必要的,以提高连线半导体设备的可靠性.

关键词:

在 Al 债券子上.含有HCl的度是非常高的结合线的连接线.电腐蚀是一种电腐蚀.一个半导体半导体.

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