用于混合结合应用的Cu(Ag) 合金的组合调节性质
Sarabjot Singh1, Kathleen Dunn1
1Department of Nanoscale Science and Engineering, University at Albany, State University of New York, Albany, NY 12203, USA.
Materials (Basel, Switzerland)
|December 9, 2023
概括
铜-银 (Cu(Ag)) 合金薄膜对混合粘合互连具有前景. 脉冲电化学沉积允许通过调整银含量来调整硬度和导电性等材料性质,使Cu(Ag) 成为可行的替代材料.
科学领域:
- 材料科学 材料科学 材料科学
- 电化学 电化学 电化学
- 纳米技术 纳米技术
背景情况:
- 混合结合需要具有定制性质的先进互连材料.
- 铜-银 (Cu(Ag)) 合金正在作为提高性能的潜在替代品进行探索.
研究的目的:
- 通过脉冲电化学沉积 (PED) 沉积的Cu(Ag) 合金薄膜的特性.
- 评估Cu(Ag) 作为混合粘合中晶圆到晶圆金属互连的候选材料.
主要方法:
- 用于薄膜制造的脉冲电化学沉积 (PED).
- 二次离子质谱 (SIMS) 用于确定含银量.
- 扫描传输电子显微镜 (STEM) 使用能量分散式X射线光谱 (EDS) 进行微观结构分析.
- 四点探针用于电阻测量.
- 用于热膨胀系数 (CTE) 分析的X射线衍射 (XRD).
- 用于模量和硬度测量的纳米印记.
主要成果:
- 在Cu(Ag) 薄膜中的银含量随着PED期间工作周期的增加而降低.
- 在电影中观察到的银的均分布.
- 电阻,CTE,扬模和硬度都显示出对银含量的线性依赖.
- 观察到CTE,模量和硬度的显著增加,添加了1.25原子%的Ag.
结论:
- () 合金薄膜通过通过PED通过控制的银含量表现出调节性质.
- 银含量与材料特性之间的可预测关系使Cu () 成为一个非常有前途的材料.
- () 是混合粘合中先进的晶圆到晶圆互连应用的强有力的候选者.
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