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Author Spotlight: Introduction to Active Probe Atomic Force Microscopy with Quattro-Parallel Cantilever Arrays

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多维拼接方法,使用波长调节的干扰度和不受约束的支持工具,用于大型薄平行板.

Shuai Zhang, Xi Hou, Wei Yan

|December 13, 2023

概括

通过使用厚度对齐 (MSuTA) 的多维拼接方法,测量大型薄平行板现在更容易. 这种新技术准确地测量了表面和厚度,提高了光学元件制造的分辨率.

科学领域:

光学计量学是指光学计量学.
表面表征表征表征的表征表征.
薄膜分析的分析方法

背景情况:

由于当前方法的局限性,测量大型薄平行板具有重大挑战.
精确的表面和厚度测量对于光学元件制造和质量控制至关重要.

研究的目的:

引入一种使用厚度对齐 (MSuTA) 的新型多维拼接方法,用于精确测量大型薄平行板.
解决测量表面和厚度偏差的挑战,包括由弹性变形引起的偏差.

主要方法:

采用波长调节干扰仪 (WTI) 和平行板自我干扰的亚光圈合.
采用基于Legendre多项式的拼接校正模型来分析和分离不受约束的支下弹性变形的偏差.
分析由三点无约束系统支的薄板的应力状态.

主要成果:

在6.3毫米厚的6英寸平行板上进行实验验证,获得了比0.35nm RMS更好的接残留物.
与12英寸垂直干扰仪相比,表现出优异的性能,表面和厚度偏差低于0.8nm RMS.
在横向分辨率上实现了近四倍的改进,使表面信息显示更加详细.

结论:

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在测量大型平行薄板时,MSuTA方法提供了显著的进步.

该技术提供了高精度和更好的分辨率,这对于制造和计量学至关重要.

这些发现为在不受约束的支持下分析薄光学元件的弹性变形提供了宝贵的见解.