使用热梯度在低温下快速Au-Sn结合的一种方法

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Wenchao Wang1,2, Ziyu Liu1,2, Delong Qiu2

  • 1State Key Laboratory of Integrated Chips and Systems, School of Microelectronics, Fudan University, Shanghai 200433, China.

Micromachines
|December 23, 2023
PubMed
概括

金 (Au-Sn) 微利用热梯度结合 (TGB) 进行微电机系统 (MEMS) 和3D包装. 这种方法在较低的温度下实现高粘合强度,优化Au-Sn金属间化合物形成以提高可靠性.

关键词:
在 Au-Snn 中.翻转芯片是什么意思金属间化合物 (IMC) 是一种金属间化合物.固态扩散 (SSD) 是一种热梯度结合 (TGB) 是一种

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