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提高热成型电子产品中电子元件定位精度的方法
Behnam Madadnia1, Jan Vanfleteren1, Frederick Bossuyt1
1Centre for Microsystems Technology, Imec and Ghent University, Technology Park 126, B-9052 Ghent, Belgium.
Micromachines
|December 23, 2023
概括
三种新方法精确地定位热成型电子中的电子元件. 这些技术可以防止变形,确保先进的模具内电子应用的导电性和可重复性.
科学领域:
- 材料科学 材料科学 材料科学
- 电子工程 电子工程
- 制造业 制造技术 制造技术
背景情况:
- 热成型电子产品需要精确的部件放置功能.
- 传统的模具内电子方法往往会导致变形的轨道和糟糕的可复制性.
- 在热成型过程中保持基质完整性对于可靠的电子性能至关重要.
研究的目的:
- 引入三种用于热成型电子产品中精确定位电子元件的新方法.
- 在热成型过程中确保印刷油墨轨道的机械和电气完整性.
- 为了提高组件放置在3D电子设备中的可复制性和精度.
主要方法:
- 开发了三种不同的方法,以保持基板区域低于玻璃过渡温度 (Tg) 为基础.
- 在半球模具中实施的方法用于定位LED和电容触摸传感器.
- 与典型的模具内电子制造工艺相比,比较了拟议的方法.
主要成果:
- 提出的方法可以防止印刷油墨轨迹和的变形和拉伸.
- 在热成型后,电子元件保持了导电性和精确的3D定位.
- 触摸传感器的形状与2D设计保持一致,与典型的过程不同.
结论:
- 提出的方法可以在热成型电子产品中高精度定位电子元件.
- 这些技术克服了传统模具内电子设备在轨道完整性和可重复性方面的局限性.
- 这些发现有助于通过热成型开发可靠和复杂的3D电子设备.
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