单晶铜的磁场辅助削过程
Xian Wu1, Kechuang Zhang1, Ke Sun1
1College of Mechanical Engineering and Automation, Huaqiao University, Xiamen 361021, China.
Micromachines
|December 23, 2023
概括
磁场辅助的铜削减少了摩擦,并提高了26.8%的表面表面. 这种创新方法通过促进脱位滑动和减少芯片变形来提高加工能力.
科学领域:
- 材料科学 材料科学 材料科学
- 制造业 工程 制造工程
- 部落学 (tribology) 是一个学科.
背景情况:
- 能量场辅助切割提高了加工质量,减少了切割力.
- 磁场为改进切割过程提供了一种新的方法.
研究的目的:
- 为了研究磁场辅助划伤对单晶铜的影响.
- 分析切削力,摩擦和表面质量的变化.
主要方法:
- 在单晶铜上进行了用磁场辅助和没有磁场辅助的划痕实验.
- 测量了划伤力,摩擦系数和表面粗度.
- 分析了芯片变形和表面地形.
主要成果:
- 磁场辅助的划伤增加了由于洛伦茨力而造成的划伤力.
- 摩擦系数下降了19.4%,这是由于tribological修改.
- 表面粗度平均降低了26.8%,芯片变形减少,微波纹减少.
结论:
- 磁场辅助切割可以提高金属材料的可加工性.
- 磁场的存在促进了脱位滑动,增强了材料的移除和表面完整性.
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