相对位移和最小芯片厚度对肩削表面纹理的影响
Lukasz Nowakowski1, Slawomir Blasiak1, Michal Skrzyniarz1
1Department of Machine Design and Manufacturing Engineering, Kielce University of Technology, al. Tysiaclecia Panstwa Polskiego 7, 25-314 Kielce, Poland.
Materials (Basel, Switzerland)
|December 23, 2023
概括
这项研究开发了一种数学模型,用于预测X37CrMoV51钢的肩部削时的表面粗度 (Ra). 该模型根据每颗牙的料,角半径和活跃插件准确预测粗度,达到0.96.96的高相关系数.
科学领域:
- 材料科学与工程 材料科学与工程
- 制造过程 制造过程 制造过程
- 表面计量学 表面计量学
背景情况:
- 削过程中的表面纹理形成是复杂的,受到多个变量的影响.
- 控制表面粗度对于元件性能和寿命至关重要.
研究的目的:
- 为了开发一个预测性数学模型的表面粗度参数Ra在肩部削.
- 研究关键加工参数对表面粗度的影响.
主要方法:
- 在垂直机上使用方形肩面磨机对X37CrMoV51钢进行肩磨.
- 开发一个预测模型,包括每颗牙的料 (fz),角半径 (re),活跃插件的数量,最小芯片厚度 (hmin) 和位移D (ξ).
- 对实证数据进行模型的实验验证.
主要成果:
- 在理论模型和表面粗度 (Ra) 的实验结果之间实现了高相关系数 (0.96).
- 几何分析显示,活性插件的数量随着料速度而变化,影响了材料的去除.
- 每颗牙的料增加导致了更高的最小芯片厚度和位移,而更高的切割速度减少了最小芯片厚度.
结论:
- 开发的数学模型可以准确地预测肩磨的表面粗度.
- 加工参数,如料率和切割速度,显著影响表面质感特征,包括最小芯片厚度和位移.
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