对于热接口材料的双相金属填充剂的电介质对齐
Yangwoo Lee1, Kubra Akyildiz1, Chanmi Kang1
1Department of Chemical & Biomolecular Engineering, Seoul National University of Science & Technology, Seoul 01811, Republic of Korea.
Polymers
|December 23, 2023
概括
这项研究提高了热接口材料 (TIM) 导电性,使用电离子电链 (DEP-C) 调整双相金属颗粒. 对齐的EGaIn-Cu复合材料填充剂显著提高了导热率和散热性能.
科学领域:
- 材料科学 材料科学 材料科学
- 热管理 热管理
- 纳米技术纳米技术
背景情况:
- 型热接口材料 (TIM) 对于电子设备的散热至关重要.
- 在TIM中实现高导热率和合规接触在很大程度上取决于填充剂的类型和含量.
- 现有的填充剂在优化热性能和接触完整性方面经常面临局限性.
研究的目的:
- 调查使用介电电离链 (DEP-C) 在TIM中对准双相金属颗粒的使用.
- 为了提高型TIM的导热率和散热能力.
- 为了评估- (EGaIn) 合金和铜 (Cu) 作为复合填充剂的有效性.
主要方法:
- 制造TIM复合材料,使用- (EGaIn) 合金和铜 (Cu) 颗粒的混合物.
- 应用电离子连锁 (DEP-C) 来对齐TIM矩阵内的双相金属填充器.
- 在DEP-C对齐之前和之后测量TIM复合材料的导热率.
- 使用发光二极管 (LED) 测试装置评估散热性能.
主要成果:
- 与单个填充剂相比,DEP-C有效地对准了双相EGaIn-Cu粒子,与融合增强了对齐.
- 在DEP-C调整后,TIM复合材料的导热率显著增加.
- 含有EGaIn和Cu填充剂的TIM在导热性方面表现出最大的增强,高达64.6%.
- 在实际的LED应用中,对齐的填充器导致了更好的散热性能.
结论:
- 介电电泳链是一种可行的方法,用于在TIM中对准双相金属填充剂.
- 复合材料填充剂,特别是EGaIn-Cu,在通过DEP-C对齐时,可以提供卓越的导热增强.
- 开发的TIM显示了电子设备的热管理能力的改进.
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