通过射频喷射培养的氧氧氧化物记忆器中,氧气流控制的电阻切换和电容性行为之间的相关性
Hye Jin Lee1, Jeong-Hyeon Kim1, Jongyun Choi1
1Department of IT & Semiconductor Convergence Engineering, Tech University of Korea, Siheung, 15073, Republic of Korea.
Heliyon
|December 25, 2023
概括
氧化 (Ga2O3) 记忆器中的容量随着电阻状态的显著变化而变化. 在制造过程中控制的氧气空缺直接影响这些电容变化,影响设备性能.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 固态物理 固态物理
背景情况:
- 电阻开关 (RS) 记忆器在电子设备中提供了有前途的应用.
- 氧化 (Ga2O3) 是用于memristor制造的新兴材料.
- 了解memristor中的电容行为对于设备优化至关重要.
研究的目的:
- 为了研究Ga2O3记忆器的双极电阻切换 (RS) 依赖电容.
- 分析氧气度对电容变化的影响.
- 阐明氧气空缺在Ga2O3记忆器电容性行为中的作用.
主要方法:
- 使用无线电频率喷射与受控的氧气流量制造Ag/Ga2O3/Pt记忆器结构.
- 在低电阻状态 (LRS) 和高电阻状态 (HRS) 中测量电容变化.
- 电容变化与生长过程中不同氧度的相关性.
主要成果:
- 在LRS的容量是超过60倍高于在HRS.
- 在HRS中增加氧气流量导致电容减少80%.
- 在LRS中增加氧气流量导致电容增加了128%.
结论:
- 在Ga2O3的memristors的电容强烈依赖于氧气空缺的密度.
- 氧气空缺调节电荷储存能力,从而调节电容.
- 控制氧度对于调整Ga2O3记忆器的电容性行为至关重要.
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