相关实验视频
Updated: Jul 30, 2026

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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
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概括
我们开发了一种新的光学拦截器,用于高效的芯片集成,实现低损耗和高错位容忍度. 这项技术使可扩展的光子集成电路用于先进的计算和通信系统.
科学领域:
- 光学和光学工程的光学和光学工程.
- 材料科学和纳米技术
- 集成电路设计 集成电路设计
背景情况:
- 光子集成电路 (PIC) 的大规模集成对于先进的计算和通信系统至关重要.
- 现有的芯片集成方法往往面临着低损耗,宽带运行和错位容忍等挑战.
- 光学拦截器为高密度,高性能光学互连提供了一个有希望的解决方案.
研究的目的:
- 设计,制造和演示一个低损耗的宽带光学拦截器,具有很高的错位容忍度.
- 为了使多个芯片的大规模集成使用热压缩翻转芯片结合.
- 为了实现晶圆尺度光子系统的高效光功率分割.
主要方法:
- 使用晶圆尺度技术制造一个光学插座器.
- 通过热压缩翻转芯片粘合,将光子集成电路模具与 evanescent 合器集成.
- 芯片间合损失和错位容忍的表征.
- 使用等功率分割器 (EPS) 进行晶圆尺度等功率分割的演示.
主要成果:
- 实现了与PIC模块的翻转芯片集成,显示了低的芯片间合损失 (0.54dB).
- 呈现出高3dB的 ±3.53μm的错位容忍度.
- 在O波段和C波段确认波长不敏感的损失,表明宽带性能.
- 成功演示了1到100个晶圆尺度相同的功率分割与路径长度匹配.
结论:
- 开发的光学插座器满足了对低损耗,宽带和耐失调芯片集成的关键要求.
- 热压缩翻转芯片粘合是一种可行的技术,用于将PIC与光学介面器集成在一起.
- 晶圆尺度制造和功率分割能力为可扩展的光子系统铺平了道路.
相关概念视频
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There are three main types of inductively coupled plasma atomic emission spectroscopy (ICP-AES) instruments: sequential, simultaneous multichannel, and Fourier transform instruments, with the latter being less commonly used.
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