在基于BaTiO3的多层陶电容器中,对电气降解过程的热激活能量提供了终身可靠性
Jinsung Chun1, Jungwoo Heo2, KyungSoo Lee3
1MLCC Development Team, Component Biz. Unit, Samsung Electro-Mechanics Co. Ltd., Gyunggi-Do, Suwon, 16674, Republic of Korea. thousandjs@gmail.com.
Scientific reports
|January 5, 2024
概括
多层陶电容 (MLCC) 的激活能量大约为1.5 eV,高于之前报告的值. 这表明电子过程,而不仅仅是氧气空缺,影响MLCC故障机制.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 陶工程 陶工程
背景情况:
- 多层陶电容 (MLCC) 对于汽车应用至关重要,需要高容量和可靠性.
- 终身预测通常使用基于Arrhenius的Prokopowicz-Vaskas方程来计算激活能量.
- 以前的研究将MLCC的失败与氧气空位迁移与较低的激活能 (~1.0 eV) 联系起来.
研究的目的:
- 研究用于汽车应用的原型MLCC的激活能量.
- 了解在热激活过程中导致MLCC故障的传导机制.
- 确定开发具有增强寿命可靠性的MLCC的关键指标.
主要方法:
- 利用基于Arrhenius的Prokopowicz-Vaskas方程进行终身预测.
- 在热激活过程中的原型MLCC的计算激活能量.
- 将实验激活能量值与文献数据和材料特性进行比较.
主要成果:
- 原型MLCCs表现出约1.5 eV的一致激活能量.
- 这个值明显高于与氧空位迁移相关的~1.0 eV.
- 观察到的1.5 eV激活能量接近于BaTiO3.3带隙能量的一半 (Eg/2 ≈ 1.6 eV).
结论:
- 仅靠氧气空位迁移无法完全解释MLCC故障的导电机制.
- 为了全面理解,必须考虑电子过程和氧气空位行为.
- 确定的激活能量作为未来的MLCC开发的有价值指标,专注于高寿命可靠性.
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