基于模拟,全面了解TGO生长模式对热屏障涂层故障的影响
Da Qiao1,2,3,4, Jixin Man1,2,3,4, Wengao Yan1,2,3,4
1Advanced Gas Turbine Laboratory, Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing 100190, China.
Materials (Basel, Switzerland)
|January 11, 2024
概括
热生长氧化物 (TGO) 增长压力导致热屏障涂层 (TBC) 发生故障. 不均的TGO增长改变了故障机制,转移了易受伤害的地点并加速了损害,指导了先进的TBC发展.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 表面工程是什么?表面工程是什么?
背景情况:
- 热屏障涂层 (TBC) 对于在高温环境中保护元件至关重要.
- 在操作过程中形成的热生长氧化物 (TGO) 是由于诱导生长压力的 TBC 失败的主要原因.
- 了解TGO生长模式对于预测和减轻TBC退化至关重要.
研究的目的:
- 为了研究不同TGO生长模式下的TBC的失败行为.
- 分析TBC/TGO接口上的应力分布和裂变机制.
- 阐明非均的TGO生长对TBC耐久性的影响.
主要方法:
- 开发一个TBC热力学数值模拟模型.
- 纳入材料的可塑性和爬行行为.
- 在TBC/TGO接口上实现非统一的TGO增长和凝聚性元素.
主要成果:
- 不均的TGO增长显著改变了TBC/TGO接口上的压力分布.
- 横向的TGO增长将脆弱的地点从高峰以外的位置转移到低谷以外的位置.
- 由于不均的生长,在山谷以外的地点的加速损伤导致修改的故障模式.
结论:
- 这项研究提供了对由TGO生长驱动的TBC失败机制的关键见解.
- 不均的TGO增长被确定为影响TBC寿命的关键因素.
- 结果为设计更有弹性和先进的TBC系统提供了指导.
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