碳基填充剂对-陶化合物的电磁屏蔽性能的影响
Rafael Seidel1, Konrad Katzer1, Jakob Bieck1
1Fraunhofer Institute of Material and Beam Technology IWS, 01277 Dresden, Germany.
Materials (Basel, Switzerland)
|January 23, 2024
概括
碳基添加剂显著提高了粘合剂中的电导率和电磁干扰 (EMI) 屏蔽. 即使少量的填充剂,如碳黑和纳米管,也会大大提高屏蔽效果,达到高达43dB.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 聚合物化学 聚合物化学
背景情况:
- 无线系统的功率和频率不断增加,需要先进的屏蔽解决方案.
- 粘合剂和陶化合物需要提高电导率和电磁干扰 (EMI) 屏蔽性能.
研究的目的:
- 调查碳基填充剂对粘合剂电导率和EMI屏蔽的影响.
- 分析填充剂类型,数量和分散对风湿行为和屏蔽性能的影响.
主要方法:
- 用各种碳基填充剂 (碳黑,回收碳纤维,碳纳米管,复杂纳米材料) 制备样本,使用双非对称离心机和三卷机.
- 评价电导率,EMI屏蔽效率和质性质 (复杂粘度).
主要成果:
- 小度的填充剂导致了EMI屏蔽性能的显著改善.
- 填充剂的类型,含量和分散技术极大地影响了导电性,屏蔽性和质性.
- 实现了超过20dB的屏蔽值,复杂的填充剂达到高达43dB (99.99%的信号减少).
结论:
- 碳基填充剂在增强粘合剂和陶化合物的EMI屏蔽方面非常有效.
- 分散方法和填充剂特性在优化性能方面发挥着至关重要的作用.
- 达到的屏蔽水平满足了先进无线通信应用的需求.
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