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Updated: Jul 5, 2025

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半导体中的双材料接口的凝聚性特性:使用反向凝聚性接触方法进行实验研究和数值模拟

Caio Adler1, Pedro Morais1, Alireza Akhavan-Safar2

  • 1Faculdade de Engenharia, Universidade do Porto, Rua Dr. Roberto Frias, 4200-465 Porto, Portugal.

Materials (Basel, Switzerland)
|January 23, 2024
PubMed
概括

这项研究量化了半导体包装的界面断裂特性,揭示了环氧成型化合物和聚胺接口的关键数据,以提高设备可靠性和预测故障.

关键词:
双材料接口的接口有凝聚力的区域建模.断裂能量 断裂能量介面骨折 介面骨折 介面骨折 介面骨折半导体 半导体 半导体

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