为高功率运行优化AlGaN/GaN高电子流动性晶体管的网关-头部-顶部/底部长度,具有高功率运行的网关内置结构:模拟研究研究
Woo-Seok Kang1, Jun-Hyeok Choi1, Dohyung Kim1
1Division of Electronics and Electrical Engineering, Dongguk University-Seoul, Seoul 04620, Republic of Korea.
Micromachines
|January 23, 2024
概括
这项研究优化了AlGaN/GaN HEMT的高功率,通过延长门头,将故障电压提高了52%. 随后的门进一步提高了性能,将故障电压提高了35%,同时保持了射频特征.
科学领域:
- 半导体设备物理学 半导体设备物理
- 材料科学 是一种材料科学.
- 电气工程 电气工程 电气工程
背景情况:
- 化/化 (AlGaN/GaN) 高电子流动性晶体管 (HEMT) 对于高功率应用至关重要.
- 在不牺牲无线电频率 (RF) 性能的情况下提高故障电压是一个关键的挑战.
研究的目的:
- 优化AlGaN/GaN HEMT结构,以提高故障电压和高功率运行.
- 调查门头延伸和门结构对设备性能的影响.
主要方法:
- 设备模拟和制造T门AlGaN/GaN HEMTs.设备模拟和制造T门AlGaN/GaN HEMTs.
- 系统地扩展门头结构的0.2微米增量到1.0微米.
- 引入一个门结构,具有不同的AlGaN屏障层厚度.
主要成果:
- 一个1.0微米门头扩展的HEMT显示故障电压增加了52%.
- 门的延伸导致了切断频率 (ft) 和最大频率 (fmax) 的降低.
- 在扩展的HEMT上,一个6纳米的门回结构提高了ft的9%,fmax的28%,并进一步增加了故障电压的35%.
结论:
- 优化的结构,一个1.0微米门头扩展HEMT与6纳米门,平衡直流和射频特征的高功率应用.
- 这种设计可以显著改善故障电压,这对于要求高的电子系统至关重要.
- 这项研究证明了一种可行的方法来提高下一代动力电子产品的AlGaN/GaN HEMT的性能.
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