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关于SiC陶复合材料的磨削加工技术的审查

Huiyun Zhang¹, Zhigang Zhao¹, Jiaojiao Li¹

¹School of Mechanical Engineering, North University of China, Taiyuan 030051, China.

|January 23, 2024

概括

本综述涵盖了碳化 (SiC) 陶基质复合材料 (CMC) 的先进磨削加工,解决了在高性能应用中面部损伤和强度降低等挑战.

科学领域:

材料科学材料科学材料科学
制造业工程制造工程

背景情况:

陶矩阵复合材料 (CMC) 具有优越的性能,如耐高温和低密度,非常适合航空航天和能源行业.
尽管有优势,但CMC由于脆性,异构性和纤维矩阵接口问题而存在加工挑战,导致表面损坏和强度降低.

研究的目的:

审查SiC陶复合材料的最新磨蚀性加工技术.
确定CMC加工的特性,研究方向和模拟方法.
总结处理困难和未来研究热点.

主要方法:

研磨机加工技术的审查:研磨,激光辅助研磨,超声波辅助研磨和研磨水喷机加工.
关于模拟CMC加工的数值模拟研究的摘要.
对表面完整性和材料去除机制的分析.

主要成果:

在CMC的磨削加工中,容易出现诸如,分层和撕裂之类的缺陷.
像激光辅助和超声波辅助研磨等先进技术显示出改善表面质量的前景.
数字模拟对于理解和优化加工过程至关重要.

结论:

对SiC陶矩阵复合材料的有效磨削加工需要解决固有的材料挑战.
进一步研究先进的辅助加工技术和模拟模型对于提高表面质量和部件性能至关重要.
优化加工策略是释放CMC在苛刻应用中的全部潜力的关键.

关键词:

磨削加工磨削加工磨削加工磨削加工陶矩阵复合材料是陶矩阵复合材料.材料清除机制材料清除机制数字模拟的数字模拟.

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