现代金属氧化物半导体场效应晶体管的可靠性理解和紧建模:从单模到混合模机制
Zixuan Sun1, Sihao Chen2, Lining Zhang2
1School of Integrated Circuits, Peking University, Beijing 100871, China.
Micromachines
|January 23, 2024
概括
先进的MOSFET需要混合模式可靠性分析. 传统的单模式方法无法预测设备的寿命,因此需要新的热载体降解和其他老化效应的模型.
科学领域:
- 半导体设备物理学 半导体设备物理
- 集成电路可靠性工程 集成电路可靠性工程
背景情况:
- 由于MOSFET的技术扩展,设计边际减少了,增加了设备可靠性的重要性.
- 传统的单模可靠性机制对于现代弹性电路设计是不够的.
研究的目的:
- 审查先进半导体设备的混合模式可靠性机制和紧的老化模型.
- 突出单模分析在预测电路寿命方面的局限性.
主要方法:
- 讨论混合模式可靠性机制,包括热载体降解 (HCD) 与自热,HCD偏差温度不稳定 (BTI) 相互作用,状态下降解 (OSD),状态下时间依赖的介电分解 (TDDB) 和金属电迁移 (EM).
- 对交替HCD-BTI压力条件的影响分析.
主要成果:
- 单模可靠性分析不足以预测先进技术和电路的寿命.
- 混合模式可靠性机制显著影响设备老化.
结论:
- 混合模式可靠性分析和建模对于未来的弹性电路设计至关重要.
- 本综述为开发先进的混合模式可靠性模型提供了指导.
相关概念视频
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Enhancement-mode MOSFETs are pivotal components in electronics, distinguished by their capacity to act as highly efficient switches. They are part of the larger family of metal-oxide Semiconductor Field-Effect Transistors (MOSFETs). They are available in two types: p-channel and n-channel, each tailored to specific polarity operations.
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