为了在晶圆尺度上组装球形合体的2D可调的水晶图案

Kai Sotthewes1, Gijs Roozendaal1,2, Andris Šutka3

  • 1Physics of Interfaces and Nanomaterials, MESA+ Institute, University of Twente, P.O. Box 217, 7500AE Enschede, The Netherlands.

PubMed
概括

科学家们开发了一种干粉组装方法,用于硬表面上的合晶体. 这种技术使用手动和PDMS印来创建六角密封 (HCP) 结构,从而使微电子和传感领域的新应用成为可能.

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