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Planar and Three-Dimensional Printing of Conductive Inks
Published on: December 9, 2011
Yinjia Yan1,2, Miao Han1,2, Yixue Jiang2,3
1Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China.
增材制造 (AM) 为新型电子设备提供了导电聚合物 (CP) 的先进3D打印. 本综述探讨了AM技术,材料要求和未来电子产品的应用.
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