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用于增材制造的电导聚合物
Yinjia Yan1,2, Miao Han1,2, Yixue Jiang2,3
1Frontiers Science Center for Flexible Electronics (FSCFE), Xi'an Institute of Flexible Electronics (IFE), Xi'an Institute of Biomedical Materials and Engineering (IBME), and Ningbo Institute, Northwestern Polytechnical University, 127 West Youyi Road, Xi'an 710072, China.
ACS applied materials & interfaces
|January 29, 2024
概括
增材制造 (AM) 为新型电子设备提供了导电聚合物 (CP) 的先进3D打印. 本综述探讨了AM技术,材料要求和未来电子产品的应用.
科学领域:
- 材料科学与工程 材料科学与工程
- 聚合物化学 聚合物化学
- 增材制造 增材制造 增材制造
背景情况:
- 电导聚合物 (CPs) 将聚合物特性与金属/半导体电子特性相结合.
- 传统的制造方法与非平面形态和较差的离子/电子移动性作斗争.
- 增材制造 (AM) 为基于CP的先进电子设备制造提供了机会.
研究的目的:
- 为增材制造 (AM) 提供导电聚合物 (CPs) 最近研究进展的概述.
- 讨论各种AM技术,它们的挑战,以及印刷CP的材料要求.
- 探索AM衍生CP的潜在电子应用.
主要方法:
- 对用于增材制造 (AM) 的导电聚合物 (CPs) 的最新研究进行审查.
- 分析不同的AM技术:光聚合 (VP),材料挤出 (ME),粉床融合 (PBF),材料喷射 (MJ) 和层叠物体制造 (LOM).
- 讨论材料要求和CP的3D打印的进展.
主要成果:
- 增材制造 (AM) 能够为导电聚合物 (CP) 设备提供更大的设计自由,复杂的结构和快速原型.
- 各种AM技术正在开发用于CP的3D打印,每个都有特定的进展和挑战.
- 在CP的3D打印方面取得了重大进展,满足电子应用的材料要求.
结论:
- 增材制造 (AM) 是制造先进导电聚合物 (CP) 电子设备的一个有前途的方法.
- 未来的电子应用包括可穿戴电子产品,传感器和能量存储/转换设备.
- 在CP的AM方面持续的研究和开发将推动电子设备设计的创新.
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