3D DRAM:?

Shujuan Mao1, Guilei Wang1, Chao Zhao1

  • 1Beijing Superstring Academy of Memory Technology, China.

National science review
|February 5, 2024
PubMed
概括

无形氧化物半导体 (AOS) 被评估为单体3D DRAM的关键组件. 这一观点探讨了将AOS集成到先进的内存技术中的挑战和未来研究方向.

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