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具有不同Cu含量的Ni-Cu薄膜的三维表面立体分析

Vali Dalouji¹, Samira Goudarzi¹

¹Department of Physics, Faculty of Science, Malayer University, Malayer, Iran.

|February 5, 2024

概括

这项研究使用原子力显微镜 (AFM) 立体分析-铜 (Ni-Cu) 薄膜. 结果揭示了铜含量如何影响表面粗度和微纹理,这对于纳米结构建模至关重要.

科学领域:

材料科学材料科学材料科学
表面科学是一门学科.
纳米技术纳米技术

背景情况:

-铜 (Ni-Cu) 薄膜在各种技术应用中至关重要.
了解它们的表面微观结构对于预测性能至关重要.
原子力显微镜 (AFM) 提供高分辨率的表面地形数据.

研究的目的:

为了对Ni-Cu薄膜进行立体分析.
使用AFM数据来描述3D表面微纹.
为了将微纹理参数与铜含量和薄膜特性相关联.

主要方法:

通过RF-PECVD制备Ni-Cu薄膜.
使用原子力显微镜 (AFM) 获取表面地形图.
根据ISO 25178-2:2012和ASME B46.1-2009标准对AFM数据进行立体分析.

主要成果:

40% Cu 的 Ni-Cu 薄膜表现出更不规则的表面,最大 Sq 值为 81.24 μm.
在183.4μm的40%Cu薄膜中观察到最大的核心粗高度 (Sk).
7以下的表面度 (Sku) 表示最小的山峰/山谷,5%的Cu薄膜显示3.568的值;增加的Cu含量导致更均的高度分布.

结论:

对AFM数据的立体分析为Ni-Cu薄膜提供了定量微纹理参数.
铜含量显著影响Ni-Cu薄膜的表面粗度和微纹理.
这些发现可以验证纳米结构表面参数预测的理论模型.

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