环氧基铜 (Cu) 烧结糊用于增强结合强度和防止烧结后的Cu氧化
Seong-Ju Han1, Seungyeon Lee1, Keon-Soo Jang1
1Department of Polymer Engineering, School of Chemical and Materials Engineering, The University of Suwon, Hwaseong 18323, Gyeonggi-do, Republic of Korea.
Polymers
|February 10, 2024
概括
这项研究引入了用于先进半导体包装的环氧增强铜烧结. 环氧改善了铜的性能.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体包装 半导体包装
- 互连技术 互连技术 互连技术
背景情况:
- 传统的银烧结是昂贵的.
- 铜提供了一个具有成本效益的替代品,但面临着氧化挑战.
- 环氧集成解决了铜的氧化,并提高了机械性能.
研究的目的:
- 调查环氧在半导体包装铜烧结中的作用.
- 优化复合材料的组成和烧结条件,以提高性能.
- 为了评估环氧对烧结铜的电气,机械和抗氧化性能的影响.
主要方法:
- 烧结不同环氧成分的铜 (20%重量最佳).
- 使用特定的预热 (200°C) 和烧结 (250°C) 温度.
- 电导率,热导率,剪切强度和氧化抵抗的特征.
主要成果:
- 双甲环氧 (Da) 增强烧结铜的实验室剪切强度达到35.9MPa.
- 环氧显著降低了氧化;氧含量在30天后从37.6%降至4.5%.
- 一个月后,含有环氧的样本保持了优越的电和热导率.
结论:
- 环氧集成,特别是双甲环氧,增强粘附性并抑制铜的氧化.
- 最佳的复合材料成分 (20%重量环氧) 和烧结条件对于所需的性能至关重要.
- 这项研究为开发强大且具有成本效益的基于铜的互联网提供了基础.
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