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Analysis of Contact Interfaces for Single GaN Nanowire Devices
Published on: November 15, 2013
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压缩结合的GaN/钻石接口的热传输和机械应力映射,用于垂直电源设备
William Delmas1, Amun Jarzembski1, Matthew Bahr1
1Sandia National Laboratories, Albuquerque, New Mexico 87123, United States.
ACS applied materials & interfaces
|February 19, 2024
概括
研究人员开发了一种新的室温压缩粘合方法,用于化 (GaN) 和钻石,改善垂直设备的热管理. 这种技术避免了复杂的表面激活,实现了高热边界导电性和低应力.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体设备工程 半导体设备工程
- 热管理 热管理
背景情况:
- 化 (GaN) 电子产品从钻石散热器中受益,以改善热管理.
- 现有的GaN-钻石粘合方法面临工程挑战,特别是垂直设备架构.
- 鉴定粘合质量对于可靠的热性能至关重要.
研究的目的:
- 展示一种新的室温压缩粘合方法,用于整合GaN和钻石.
- 为了在垂直的GaN设备中实现高的热边界导电性和低的内在应力.
- 为埋藏的GaN-钻石接口建立可靠的表征技术.
主要方法:
- 使用Ti/Au金属间层将厘米尺度的GaN和钻石与室温压缩粘合.
- 使用传输电子显微镜 (TEM) 进行埋藏接口成像.
- 使用共聚焦声扫描显微镜 (C-SAM) 进行总粘合面积评估.
- 空间分辨的频域热反射率 (FDTR) 用于测量热传输.
- 拉曼光谱绘图用于评估在接口附近的应力分布.
主要成果:
- 通过室温金属对金属的压缩粘合,GaN和钻石的成功集成.
- 在结合区域实现高热边界导电性 (>100 MW/m2·K).
- 在结合良好的GaN区域中观察到低压力 (<80 MPa).
- FDTR和拉曼测绘显示,热结合较差和高压力区域之间存在相关性.
结论:
- 开发的方法为GaN-钻石集成提供了表面激活结合的可行替代方案.
- 这种方法有效地提高了垂直GaN设备的热管理.
- 使用FDTR和Raman进行全面的表征对于评估债券质量和可靠性至关重要.
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