对于先进技术节点的新结构晶体管CMOS ICs ICs
Qingzhu Zhang1,2, Yongkui Zhang1,2, Yanna Luo1,3
1Integrated Circuit Advanced Process R&D Center, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing 100029, China.
National science review
|February 23, 2024
概括
未来的集成电路开发依赖于超越传统扩展的垂直晶体管堆叠. 互补场效应晶体管 (CFET) 和其他3D结构的创新为先进电子产品提供了更高的密度和性能.
科学领域:
- 电气工程 电气工程
- 材料科学 材料科学 材料科学
- 计算机工程 计算机工程
背景情况:
- 集成电路 (IC) 的进步历来取决于晶体管的结构创新.
- 从平面晶体管过渡到FinFET和GAAFET引入了3D通道,以改善控制和性能.
- 超出1纳米节点的几何缩放限制需要新的方法来延续摩尔定律.
研究的目的:
- 审查用于下一代IC的晶体管结构研究和开发的创新工作.
- 为突出关键的过程突破和设计方法用于先进的晶体管架构.
- 讨论未来的前景,包括新的道材料和操作原则.
主要方法:
- 关于晶体管结构创新的最新文献的审查.
- 对像CFET,3DS FET和VFET这样的垂直晶体管堆叠技术的分析.
- 探索缩小细胞大小和先进的设计方法.
主要成果:
- 垂直晶体管堆叠提供了一种革命性的方法来扩展IC超越几何界限.
- 3D通道架构提供了增强的静电完整性和更高的操作电流.
- 新的晶体管设计允许增加密度和灵活的电路/系统配置.
结论:
- 垂直晶体管堆叠对于超过1纳米节点的持续IC开发至关重要.
- 对于晶体管结构,材料和操作理论的持续创新至关重要.
- 先进的晶体管设计为未来的高性能集成电路铺平了道路.
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