设计和模拟用于组合导航的包装系统芯片
Yang Yang1, Guangyi Shi2, Yufeng Jin1
1School of Electronic and Computer Engineering, Shenzhen Graduate School of Peking University, Shenzhen 518055, China.
Micromachines
|February 24, 2024
概括
本研究介绍了用于联合导航的紧系统包,集成卫星和惯性导航芯片. 该设计满足20mm × 20mm芯片内的硬件需求,显示出出色的信号,功率和热性能.
科学领域:
- 电气工程 电气工程
- 计算机工程 计算机工程
- 导航系统 导航系统
背景情况:
- 导航系统的小型化对于先进的应用程序至关重要.
- 整合多种导航技术带来了重大的工程挑战.
研究的目的:
- 提出和验证一个系统包 (SiP) 系统,用于联合卫星和惯性导航.
- 为了实现关键导航组件的硬件集成,在一个紧的形式因素.
主要方法:
- 利用电线粘合,芯片堆叠和表面安装工艺进行组件集成.
- 开发了20毫米×20毫米SiP外卫星导航芯片,惯性导航芯片和微处理器.
- 进行多物理模拟来分析包装设计的性能.
主要成果:
- 实现的插入损失> -1 dB@1 GHz和返回损失<-10 dB@1 GHz对于天线信号.
- 在MCU和IMU之间的信号噪声约为20%,最大合系数为13.4174%.
- 电力输送网络呈现直流电压下降<2%,最高温度为~42°C.
结论:
- 拟议的SiP设计成功地将联合导航功能集成到一个小的足迹中.
- 模拟结果证实了设计的强大的信号完整性,功率传输和热管理.
- 这种紧的导航芯片为空间有限的导航应用提供了可行的解决方案.
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