模拟研究FinFET设备在单次事件上调中的电荷收集机制
Hongwei Zhang1,2, Yang Guo1, Shida Wang2
1College of Computer Science and Technology, National University of Defense Technology, Changsha 410073, China.
Micromachines
|February 24, 2024
概括
FinFET设备表现出不同的单一事件扰动 (SEU) 响应. 在SEU期间,PMOS晶体管表现出多节点电荷收集,导致SRAM扰乱和恢复,与NMOS设备不同.
科学领域:
- 半导体设备物理 半导体设备物理
- 电子产品中的辐射效应.
- 集成电路可靠性 集成电路可靠性
背景情况:
- 平面设备和FinFET设备在单一事件颠覆 (SEU) 响应和电荷收集机制方面表现出显著的差异.
- 在SEU事件期间,FinFET设备中的复杂的充电收集过程仍然没有得到充分的探索.
研究的目的:
- 调查和阐明FinFET设备在单次事件扰乱 (SEU) 期间的电荷收集过程.
- 为了比较NMOS和PMOS FinFET之间的SEU收费收集特征.
主要方法:
- 开发一个FinFET SRAM模拟结构.
- 利用先进的模拟软件来分析电荷收集动态.
- 在NMOS和PMOS FinFET中对SEU诱导的收费的比较分析.
主要成果:
- 在SEU条件下,在NMOS和PMOS FinFET之间观察到收费的显著差异.
- 发现对PMOS晶体管的直接影响会诱导多节点电荷收集.
- 在PMOS中,这种多节点充电收集现象会导致SRAM单元暂时发生故障,随后恢复.
结论:
- 在FinFET中SEU期间的电荷收集行为严重依赖于晶体管类型 (NMOS与PMOS).
- 在直接SEU事件下,PMOS FinFET表现出独特的多节点收费机制,影响SRAM稳定性.
- 了解这些差异对于设计基于FINFET的辐射硬化电路至关重要.
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