在N通道的热载体损伤EDMOS通过准静态建模用于单光子雪崩二极管细胞
Alain Bravaix1, Hugo Pitard1, Xavier Federspiel2
1IM2NP UMR 7334, REER-ISEN Méditerranée, Place G. Pompidou, 83000 Toulon, France.
Micromachines
|February 24, 2024
概括
本研究评估了用于单光子雪崩二极管 (SPAD) 电池的N通道延长排水金属氧化物半导体 (N-EDMOS) 设备的热载体损伤抵抗性. 准静态技术在加速应力条件下准确地提取了交流装置的寿命.
科学领域:
- 半导体设备物理学 半导体设备物理
- 雪崩中的光电二极管
- 可靠性工程可靠性工程
背景情况:
- 单光子雪崩二极管 (SPAD) 细胞对于成像应用至关重要.
- 在SPAD中使用N通道延伸排水金属氧化物半导体 (N-EDMOS) 晶体管.
- 热载体损坏 (HCD) 是半导体设备的重要可靠性问题.
研究的目的:
- 为了评估SPAD细胞内的N-EDMOS晶体管的热载体损伤 (HCD) 阻力.
- 在各种压力条件下比较HCD行为,包括网关电压依赖,热孔注入和PBT不稳定性.
- 通过近静态 (QS) 寿命技术,使用加速直流到交流应力准确提取交流装置寿命.
主要方法:
- 在各种压力条件下测试N-EDMOS SPAD细胞 (VGS依赖,HH注射,PBT,关机模式).
- 采用准静态 (QS) 寿命技术,将加速的直流降解转移到交流波形.
- 使用 TCAD 模拟来确定 SPAD 电池结构的精确电压和时间配置.
- 在过渡过程中分析基质电流峰值,以确定主要的降解机制.
主要成果:
- 该研究量化了HCD在N-EDMOS设备中的门电压依赖性.
- 准静态技术成功实现了精确的交流设备寿命提取,作为延迟和负载的函数.
- 在初始基质电流峰值中观察到的高能热载体被确定为过渡过程中降解的主要原因.
- 优化的N-EDMOS工艺 (L_eff = 0.25μm,T_ox = 5nm) 适用于使用CMOS成像仪进行3D粘合.
结论:
- N-EDMOS SPAD 细胞表现出特定的热载体损伤特征.
- 准静态技术提供了一个准确的方法来预测在加速应力下交流装置的寿命.
- 了解短暂降解机制是提高高频应用 (10 MHz) 的SPAD可靠性的关键.
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