新型SiC沟MOSFET带有改善的第三象限性能和切换速度
Yangjie Ou1, Zhong Lan1, Xiarong Hu2
1School of Electrical Engineering, Southwest Jiaotong University, Chengdu 611756, China.
Micromachines
|February 24, 2024
概括
这项研究引入了一种新碳化物 (SiC) MOSFET,具有增强的反向导和切换性能. 新设计减少了电压下降和寄生电容,使其成为高频电力电子应用的理想选择.
科学领域:
- 电力电子 电力电子 电力电子
- 半导体设备 半导体设备
- 材料科学 材料科学 材料科学
背景情况:
- 碳化 (SiC) MOSFET对于高功率和高频应用至关重要.
- 现有的设计面临逆向导和切换损失的挑战.
- 优化设备结构是克服这些局限性的关键.
研究的目的:
- 提出并研究一种新的SiC双槽MOSFET设计.
- 为了提高反向导电特性和切换性能.
- 为了减少寄生电容,提高高频运行.
主要方法:
- 使用二维设备模拟来分析拟议的SiC MOSFET.
- 与标准双槽MOSFET (DT-MOS) 和带有通道MOS二极管 (DTC-MOS) 的DT-MOS进行了性能比较.
- 评估了关键参数,包括前向电压下降 (VF),阻断电压 (BV),氧化物电场 (Emox),门排水电容 (Cgd) 和门排水电荷 (Qgd).
主要成果:
- 拟议的MOSFET在高电流密度 (100A/cm2) 时表现出较低的VF,防止双极退化.
- 达到降低的最大氧化物电场 (Emox) 和较低的门排水电容 (Cgd) 和电荷 (Qgd).
- 尽管特异性启动电阻略高 (Ron,sp),但该设备的开关损失显著降低.
结论:
- 新的SiC MOSFET设计提供了卓越的反向导和切换性能.
- 降低寄生电容导致高频应用的显著优势.
- 这种设计为下一代电力电子系统提供了有希望的进步.
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