研究高耐热环氧树脂的分子动力学和电特性
Changhai Zhang1,2, Zeyang Liu1,2,3, Xubin Wang1,2
1Key Laboratory of Engineering Dielectrics and Its Application, Ministry of Education, Harbin University of Science and Technology, Harbin 150080, People's Republic of China.
The Journal of chemical physics
|March 5, 2024
概括
比斯马利胺/环氧树脂 (BMI/EP55) 复合材料被开发用于耐热包装绝缘. 20%的BMI/EP55复合材料表现出优越的耐热性,玻璃过渡温度超过250°C.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物化学 聚合物化学
- 电气工程 电气工程
背景情况:
- 开发先进的包装绝缘材料需要提高热稳定性和电气性能.
- 比斯马利胺 (BMI) 和环氧树脂 (EP55) 是高性能复合材料的关键组成部分.
- 了解BMI/EP55复合材料的结构性质关系对于优化其性能至关重要.
研究的目的:
- 为制备和表征具有不同BMI含量的双胺/环氧树脂 (BMI/EP55) 复合材料,用于高温包装绝缘.
- 调查BMI结合对EP55复合材料的热,电和微观结构性质的影响.
- 阐明BMI/EP55系统中的电子结构和电荷捕获机制.
主要方法:
- 在5: 5的比例下将BMI融化成氨基四功能和烯酸环氧树脂 (EP55).
- 微结构,热 (分解温度,玻璃过渡温度) 和电性能测试 (导电性,分解强度,介电常数).
- 对BMI的静电潜力,能量水平和分子轨道的高斯计算.
主要成果:
- 在BMI中,电子阴性碳基团增强了电子捕获能力.
- 热分解温度和耐热指数随着BMI含量增加,达到20%的BMI/EP55 (>250°C Tg).
- 电气性能表现出复杂的趋势:导电性下降然后增加,断裂强度增加然后减少,介电常数随着BMI含量上升而下降.
结论:
- BMI/EP55复合材料具有可调节的热电性能,适用于高温包装绝缘.
- 20%的BMI/EP55复合材料提供出色的耐热性和绝缘能力.
- 这项研究为设计下一代高温绝缘材料提供了宝贵的见解.
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