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基于衍射的多尺度残余应变测量

Namit Pai¹, Sanjay Manda¹, Bhargav Sudhalkar¹

¹Department of Metallurgical Engineering and Materials Science, Indian Institute of Technology Bombay, Mumbai 400076, India.

Microscopy and microanalysis : the official journal of Microscopy Society of America, Microbeam Analysis Society, Microscopical Society of Canada

|March 6, 2024

概括

不同的分析技术产生不同的残余应变测量. 高分辨率的电子衍射方法,对角度变化敏感,报告比那些对间距变化敏感的更高的应变,即使经过校正.

科学领域:

材料科学材料科学材料科学
晶体学晶体学是指结晶学.
分析化学分析化学

背景情况:

现代分析工具使得多个尺度的残余应变测量成为可能.
像X射线衍射 (XRD) 和电子显微镜等技术提供了不同的尺度和分辨率.
应变值的差异源于不同的测量灵敏度.

研究的目的:

调查不同基于衍射的分析技术的残余应变测量的差异.
为了比较通过对平面间角变化敏感的方法获得的应变值与平面间距变化.
了解格子扭曲类型对测量剩余应变的影响.

主要方法:

对微焦X射线衍射 (XRD),高分辨率电子反散衍射 (HR-EBSD),高分辨率传输基库奇衍射 (HR-TKD) 和基于传输电子显微镜 (TEM) 的前置电子衍射 (PED) 的比较分析.
系统的虚拟实验,通过改变平面间角 (Δθ/θ) 或格子参数 (Δa/a) 来模拟理想格子的变形.
衍射模式的动力学和动态模拟和对应应变的测量.

主要成果:

HR-EBSD和HR-TKD对间平面角度变化敏感,与微Laue XRD和TEM-PED相比,它们对间平面间距变化敏感,其余应变值显著更高.
在HR-EBSD和微Laue XRD测量之间观察到约1.57的一致缩放因子,即使考虑到已知的错误来源.
虚拟实验证实,主要影响平面间角的格子扭曲导致比主要影响格子参数的格子扭曲更高的测量压力.

结论:

分析技术的选择显著影响测量的余应变值,因为对格子扭曲类型的灵敏度不同.
HR-EBSD和HR-TKD提供了比XRD和TEM-PED更高的剩余应变数据,当格子扭曲涉及角度变化时.
统一理解剩余应变测量需要考虑每个技术的特定灵敏度,并在必要时应用适当的缩放因子.

关键词:

在X射线衍射 (XRD) 中.衍射模式模拟的模拟.高分辨率的EBSD (HR-EBSD) 提供了更好的解决方案.剩余的菌株是一种残留的菌株.传输电子显微镜的使用

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