Fe 兴奋剂概况对基于 GaN 的 RF HEMT 电流崩的影响
Linling Xu1, Hui Guo1, Jiaqi Tao2
1Key Laboratory of Advanced Photonic and Electronic Materials, School of Electronic Science and Engineering, Nanjing University, Nanjing, Jiangsu 210093, China.
Chemistry (Weinheim an der Bergstrasse, Germany)
|March 7, 2024
概括
这项研究调查了铁 (Fe) 兴奋剂配置如何影响化 (GaN) 高电子流动性晶体管 (HEMT) 的电流崩. 优化Fe兴奋剂可以在GaN RF HEMT中减少50%以上的电流崩.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体设备物理 半导体设备物理
- 电气工程 电气工程
背景情况:
- 目前基于化 (GaN) 的高电子流动性晶体管 (HEMT) 的崩对设备性能构成重大挑战.
- 铁 (Fe) 兴奋剂在GaN HEMT中使用,但其对电流崩的影响需要详细了解.
- 了解Fe兴奋剂特征的影响对于制造可靠的GaN RF HEMT至关重要.
研究的目的:
- 在0.5μm封闭的GaN HEMT中,系统地研究Fe兴奋剂配置文件 (度,衰变速率,深度) 对当前崩幅度 (CC) 的影响.
- 为了阐明负责与Fe兴奋剂相关的当前崩的物理机制.
- 确定最佳的Fe兴奋剂策略,以减少基于GaN的射频HEMT中的电流崩.
主要方法:
- 利用技术计算机辅助设计 (TCAD) 模拟来建模和分析Fe兴奋剂效应.
- 开发精确的模拟模型,以指导实验制造.
- 研究了与Fe相关的陷的捕获/解锁与当前崩之间的相互作用.
主要成果:
- 铁注度和衰变速率显著影响电流崩,而不是注深度.
- 在二维电子气体 (2DEG) 通道附近增加的陷状态密度会加剧电流崩.
- 通过优化Fe兴奋剂配置文件,CC减少了大约50.3%.
结论:
- 目前GaN HEMT的崩归因于Fe相关缺陷的捕捉和解锁动态.
- 考虑度,衰变速率和深度的优化Fe兴奋剂配置,对于减轻电流崩至关重要.
- 这项研究为制造基于GaN的射频HEMT提供了一条途径,通过限制电流崩,显著提高性能.
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