Sn-1.5Ag-2.0Zn低银无和面向铜的界面反应
Jin Xiao1,2, Wei Cheng3, Qu Fu-Kang1
1School of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou, 511300, China.
Heliyon
|March 8, 2024
概括
调查Sn-1.5Ag-2Zn无接关节显示,与多晶铜相比,单晶 (111) 铜基板促进更大的金属间化合物 (IMC) 粒度增长. 这种差异会影响接接头的可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 表面科学是一门学科.
背景情况:
- 高密度包装需要更小的子尺寸,影响子内的粒数.
- 单晶中的粒度方向显著影响界面上的金属间化合物 (IMC) 形成.
研究的目的:
- 在Sn-1.5Ag-2Zn和单晶铜基板之间的接口上研究IMC的生长.
- 为了比较单晶 (111) 铜与多晶铜基板上的IMC形成和生长动力学.
主要方法:
- 在Sn-1.5Ag-2.0Zn无接头的复合接中,在250°C的单晶 (111) 铜和多晶红铜基板上进行5分钟的复合接.
- 随后在160°C进行长时间 (长达600小时) 的老化处理.
- 微结构分析IMC层形成 (Cu6Sn5和Cu5Zn8) 和关节形态的表征.
主要成果:
- 6Sn5IMC在两个基板上都快速生长,由于增强的原子扩散,在单晶铜上观察到更大的颗粒大小.
- 单晶铜上的Cu6Sn5的增长率在经过20小时的老化后,大约是多晶铜的两倍.
- Cu5Zn8作为多晶铜的临时屏障,抑制Cu6Sn5的生长,直到它在300小时左右分解.
- 600小时后,Cu6Sn5的厚度在单晶铜上稳定在3.5微米,而在多晶铜上,它达到2.8微米,在后者中观察到毛孔.
结论:
- 与多晶铜相比,单晶铜基板具有更快的初始IMC增长,但会产生更紧的IMC层,孔数较少.
- 单晶铜中没有粒度边界,这有利于原子扩散,影响IMC核和生长动力学.
- 该研究预测,在单晶铜上合金合剂的接质量和接口可靠性更好,为先进的包装应用提供了潜力.
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