针对5G和6G应用的先进介电共振器天线技术
Yingqi Zhang1,2,3, Stanislav Ogurtsov1, Vasilii Vasilev1
1The Antenna Company, 5656 AE Eindhoven, The Netherlands.
Sensors (Basel, Switzerland)
|March 13, 2024
概括
这篇评论探讨了用于5G及以后的介电共振器天线 (DRA) 设计. 离芯片DRA因其具有成本效益的制造和在毫米波应用中卓越的性能而受到重视.
科学领域:
- 电磁和天线工程 电磁和天线工程
- 无线通信技术无线通信技术
- 材料科学在射频应用中的RF应用
背景情况:
- 介电共振器天线 (DRA) 与传统天线相比,具有优势,包括较低的导电损失和更大的设计灵活性.
- 印刷电路板 (PCB) 和低温联合烧焦陶 (LTCC) 等成本高效的制造技术的进步,提高了离芯片DRA设计的受欢迎程度.
- 对5G和超越5G应用程序的需求日益增加,需要带有增强功能的天线,如光束方向和双频功能.
研究的目的:
- 审查和分析介电共振器天线 (DRA) 设计的最新进展.
- 专注于DRA在毫米波 (mmW) 频段的阵列配置中的适用性,特别是对于5G和未来的无线系统.
- 为了比较各种DRA设计的性能,材料使用,制造可行性和应用.
主要方法:
- 对最近的DRA设计及其进展进行了全面的文献审查.
- 对DRA设计的分类,特别关注离芯片配置 (基板内和紧型DRA).
- 基于关键参数和应用适用性的不同DRA设计的性能比较.
主要成果:
- 离芯片DRA设计,包括基板和紧型变体,由于PCB和LTCC制造的进步,正在获得突出地位.
- DRA显示了光束转向和双频操作的巨大潜力,为传统印刷天线提供了多功能替代方案.
- 详细讨论和比较各种DRA设计,强调它们在材料,制造,性能和应用方面各自的优缺点.
结论:
- 介电共振器天线为下一代无线通信系统提供了一个有希望的技术,特别是在mmW频段.
- 该审查为特定的5G和超越应用程序的DRA设计的选择和开发提供了宝贵的见解.
- 对DRA材料和集成技术的进一步研究将继续推动天线技术的创新.
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