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Updated: Aug 4, 2026

Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
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以TDI为基础的暗场散射显微镜平衡无图案晶圆缺陷检查的效率和灵敏度

Fei Yu1, Min Xu1, Junhua Wang1,2

  • 1Shanghai Engineering Research Center of Ultra-Precision Optical Manufacturing, School of Information Science and Technology, Fudan University, Shanghai 200438, China.

Sensors (Basel, Switzerland)
|March 13, 2024
PubMed
概括

这项研究将时间延迟集成 (TDI) 技术集成到用于半导体晶圆检查的暗场显微镜中. 改进后的系统可以提高缺陷检测信号与噪声的比率,而不会影响检查效率.

关键词:
暗场显微镜的使用方法没有图案的晶圆检查.光学检查检查是指光学检查.时间延迟整合集成.

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