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按剪切测试用于对二维材料的粘附度测量

Josef Schätz^1,2, Navin Nayi¹, Jonas Weber^3,4

¹Infineon Technologies AG, Wernerwerkstraße 2, 93049, Regensburg, Germany.

Nature communications

|March 19, 2024

概括

按剪切试验量化了二维 (2D) 材料在各种基板上的粘附. 这种方法对于可靠的二维微电子设备集成至关重要,克服了诸如粘附弱等挑战.

科学领域:

材料科学材料科学材料科学
微电子工程微电子工程
表面科学是一门学科.

背景情况:

二维 (2D) 材料为微电子提供了重要的潜力.
由于化学惰性导致的粘合力较弱,阻碍了2D材料可靠地集成到功能设备中.
量化粘附对于推进二维设备集成至关重要.

研究的目的:

引入和验证按剪切测试作为测量二维材料粘附力的方法.
为了评估石墨烯,六角化 (hBN),二硫化和化在二氧化和化上的粘附性.
确定影响二维材料粘附的因素.

主要方法:

在二维材料上开发聚合物按的制造工艺.
建立最佳的按尺寸和剪切测试速度.
按剪切测试的应用,以评估不同基板上的粘附性.

主要成果:

按剪切测试被证明是一种可靠和可重复的粘附量化方法.
低基板粗度和氧气等离子体处理可以提高二维材料的剪切强度.
热回火改善了hBN对二氧化的附着性,与热接口阻力相关.

结论:

按剪切测试是评估二维材料粘附性的可行技术.
表面准备方法对二维材料的粘附有很大影响.
了解粘附是释放微电子领域二维材料全部潜力的关键.

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