在用Mg合的CuO薄膜中出现持久的间歇性缺陷
Adithya Prakash1, Vikash Mishra1, M G Mahesha1
1Department of Physics, Manipal Institute of Technology, Manipal Academy of Higher Education 576104 India mahesha.mg@manipal.edu.
RSC advances
|March 27, 2024
概括
兴奋剂通过增加氧气间位缺陷来增强氧化铜 (CuO) 薄膜导电性. 这项研究系统地研究了Mg兴奋剂对CuO光电子特性的影响.
科学领域:
- 材料科学 材料科学 材料科学
- 固态物理 固态物理
- 半导体技术 半导体技术
背景情况:
- 半导体薄膜对于电子设备至关重要.
- 兴奋剂是调整材料特性的一个关键方法.
- 氧化铜 (CuO) 是一个有前途的半导体材料.
研究的目的:
- 为了研究 (Mg) 兴奋剂对氧化铜 (CuO) 薄膜光电子特性的影响.
- 了解氧介质 (Oi) 缺陷在基化CuO中的作用.
- 为了将兴奋剂诱导的结构和缺陷变化与电气和光学性能增强相关联.
主要方法:
- 喷雾热解技术用于薄膜制备.
- 在CuO薄膜中,Mg兴奋剂度 (2-10%) 不同.
- 使用X射线衍射,FESEM,拉曼,PL,XPS和Hall测量的表征.
- 密度函数理论 (DFT) 分析以获得理论见解.
主要成果:
- 胺兴奋剂导致结晶体大小的减少和带间隙的扩大.
- 观察到氧气间歇性 (Oi) 缺陷在Mg兴奋剂时增加.
- 增强的载体度和改善的电导率在化片中得到了实现.
结论:
- 胺兴奋剂有效地改变了CuO薄膜的光电子特性.
- 氧气间位缺陷在提高CuO的电导率方面发挥着重要作用.
- 该研究为潜在的应用提供了对CuOMg兴奋剂影响的全面了解.
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