通过采用交替O2等离子处理,提高了基于GaN的MIS-HEMT的稳定性和门可靠性
Xinling Xie1, Qiang Wang1, Maolin Pan1
1State Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai 200433, China.
Nanomaterials (Basel, Switzerland)
|March 27, 2024
概括
用交替O2等离子体处理的AlGaN/GaN金属绝缘体半导体高电子流动性晶体管 (MIS-HEMT) 显示出更好的值电压 (Vth) 稳定性和门可靠性. 这种增强归因于更高的导电带偏移,抑制了门泄漏电流.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 电气工程 电气工程
背景情况:
- 化/化 (AlGaN/GaN) 金属绝缘体半导体高电子移动性晶体管 (MIS-HEMT) 对于高功率和高频应用至关重要.
- 网关可靠性和值电压 (Vth) 稳定性是这些设备的关键性能指标,特别是在苛刻的操作条件下.
研究的目的:
- 研究交替O2等离子治疗对AlGaN/GaN MIS-HEMT的Vth稳定性和门可靠性的影响.
- 阐明负责设备性能观察到的改进的潜在机制.
主要方法:
- 在制造Al2O3/AlGaN接口时,采用了交替O2等离子体处理.
- 进行传导带偏移测量以量化接口属性.
- 进行了时间依赖的介电分解 (TDDB) 测试,以评估门的可靠性.
- 在高温和长期门偏差应力条件下评估了Vth稳定性.
主要成果:
- 交替O2等离子处理将Al2O3/AlGaN接口的导电带偏移提高到2.4 eV,显著抑制了门泄漏电流.
- 用交替O2等离子体处理的ALD-Al2O3薄膜表现出优越的质量和可靠性,这是TDDB结果所证明的.
- 结合这种处理的AlGaN/GaN MIS-HEMT在长时间的高温门偏差应力下显著增强了Vth稳定性.
结论:
- 交替O2等离子处理是一种有效的方法,可以提高AlGaN/GaN MIS-HEMTs的门可靠性和Vth稳定性.
- 增强的性能与改进的接口属性有关,特别是更大的导电带偏移,导致门泄漏减少.
- 这些发现表明,开发更强大,更可靠的高性能基于GaN的电子设备是一种有希望的方法.
关键词:
AlGaN/GaN MIS-HEMTT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN MIS-HEMT AlGaN/GaN/GaN/GaN/GaN/GaN/GaN/GaN门的可靠性 门的可靠性门电压的稳定性 门电压的稳定性相关概念视频
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