基于高电子移动性GaN晶体管的值电压可靠性的研究
Pengfei Dai1, Shaowei Wang2, Hongliang Lu2
1Nanjing Electronic Devices Institute, Nanjing 210016, China.
Micromachines
|March 28, 2024
概括
高电子流动性晶体管 (HEMT) 设备由于温度和门应力而表现出值电压漂移. 本次审查分析了稳定的高压运行机制,并提出了改进措施.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 高电子移动性晶体管 (HEMT) 对于高压,高频应用至关重要.
- 这些设备在操作压力下容易受到值电压 (VTH) 漂移的影响.
- VTH漂移会影响设备的稳定性和电路的整体性能.
研究的目的:
- 在GaN HEMTs中审查和分析VTH漂移背后的物理机制.
- 为了研究温度的影响,门应力和门接触变化.
- 总结了在苛刻条件下改善GaN HEMT性能的方法.
主要方法:
- 对GaN HEMT VTH漂移现有研究的文献综述.
- 分析与温度和门应力相关的物理机制.
- 研究门接触对VTH稳定性的影响.
主要成果:
- 确定了温度变化,门应力和门接触差异作为VTH漂移的关键因素.
- 确定了这些因素与GaN HEMT设备的不稳定性之间的联系.
- 突出了VTH漂移对电路可靠性的关键影响.
结论:
- 了解VTH漂移的根本原因对于GaN HEMT可靠性至关重要.
- 建议的改进策略对于高温和高压应用至关重要.
- 进一步的研究可以导致更强大,更稳定的GaN HEMT设备设计.
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