嵌入基质的热散热结构的分析和验证 基于方形frustums的电源芯片中的基质 热通过介质
Fengjie Guo1, Kui Ma1,2,3, Jingyang Ran1
1Department of Electronics, Guizhou University, Guiyang 550025, China.
Micromachines
|March 28, 2024
概括
一个新的散热结构使用方形和热通道改善了电源芯片的冷却. 与传统的芯片稀释方法相比,这种新的设计提供了优越的散热.
科学领域:
- 材料科学 材料科学 材料科学
- 热力工程是热力工程中的一个.
- 半导体设备物理 半导体设备物理
背景情况:
- 电源芯片产生大量的热量,需要有效的热管理解决方案.
- 像芯片稀释这样的现有方法可能会损害结构完整性,并带来制造方面的挑战.
- 改善散热对于提高功率芯片性能和可靠性至关重要.
研究的目的:
- 建议和评估一种新的散热结构,用于电源芯片.
- 提高热管理能力,同时简化制造工艺.
- 将拟议结构的有效性与传统的芯片稀释技术进行比较.
主要方法:
- 热传递和热电合可靠性的理论分析.
- 为拟议的结构建立传热和可靠性模型.
- 新型结构和芯片稀释之间的比较模拟研究.
主要成果:
- 拟议的结构有效地提高了电源芯片的散热能力.
- 它避免了与芯片稀释相关的问题,例如降低刚性和断裂风险.
- 模拟结果显示,与基板稀释相比,热性能优越.
结论:
- 新型散热结构为芯片稀释提供了可行和有效的替代方案.
- 这种设计增强了电源芯片的热管理和工艺制造能力.
- 该结构为功率电子设备提供了更好的机械稳定性和散热.
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