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Updated: Jun 29, 2025

Experimental Methods for Investigation of Shape Memory Based Elastocaloric Cooling Processes and Model Validation
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Published on: May 2, 2016

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一个新的温度漂移误差估计模型容量MEMS陀螺仪使用热应力变形分析

Bing Qi1, Jianhua Cheng1, Zili Wang1

  • 1College of Intelligent Systems Science and Engineering, Harbin Engineering University, Harbin 150001, China.

Micromachines
|March 28, 2024
PubMed
概括

一个新的模型通过使用热应力分析和辐射基函数神经网络 (RBFNN) 准确估计温度漂移误差 (TDE) 来提高容量MEMS旋转器 (CMGs) 的偏差稳定性. 这提高了复杂环境中的性能.

关键词:
在RBFNNNNNNNNNNNN基于热流分析的TDE精确测试方法电容型MEMS 陀螺仪 陀螺仪 电容型MEMS 陀螺仪温度依赖性 温度依赖性热应力变形分析分析

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