MEMS,TGV

Yahao Gao1,2, Simin Peng1,2, Xiangming Liu1,2

  • 1State Key Laboratory of Transducer Technology, Aerospace Information Research Institute, Chinese Academy of Sciences, Beijing 100190, China.

Micromachines
|March 28, 2024
PubMed
概括

这项研究引入了一种新的垂直共振MEMS电场传感器,采用Through Glass Via (TGV) 技术. 创新的设计增强了电场传输,大大提高了传感器的灵敏度.