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Updated: Jun 29, 2025

Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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微电子的现代趋势 包装 可靠性测试 测试

Emmanuel Bender1,2, Joseph B Bernstein2, Duane S Boning1

  • 1Microsystems Technology Laboratories, Massachusetts Institute of Technology, Cambridge, MA 02142, USA.

Micromachines
|March 28, 2024
PubMed
概括

本综述总结了微电子包装可靠性趋势,从电线结合和BGA到先进的3D堆叠和互连织物集成以实现异质集成 (HI). 它探讨了设计和验证方法,为未来的HI包装挑战提出了优化测试的建议.

关键词:
风扇外包装的包装包装的可靠性 包装的可靠性可靠性预测预测的可靠性相互连接的织物织物球故障 球故障

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Microcracking in concrete refers to the tiny cracks that can form within the material even before any external load is applied. These microcracks typically occur at the interface between the coarse aggregate and the hydrated cement paste, often as a result of differential volume changes prompted by variations in stress-strain behavior, as well as thermal and moisture movement. Initially, these microcracks remain stable and do not grow substantially until the concrete is stressed to about 30...
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