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Preparation of Samples for Electron Microscopy01:20

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To be visualized by an electron microscope, either transmission or scanning, biological samples need to be fixed (stabilized) so the electron beam does not destroy them and dried thoroughly (desiccated/dehydrated) so the vacuum does not affect them. Fixation needs to be done as quickly as possible because the sample properties will start changing as soon as it is removed from its natural environment. For example, in a tissue sample, the oxygen levels begin decreasing, causing an altered...
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相关实验视频

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Fabrication of Superhydrophobic Metal Surfaces for Anti-Icing Applications
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基于超疏水性铜微层的低温接技术.

Jin Xiao1,2, Qian Zhai1, Wei Cheng3

  • 1School of Mechanical and Electrical Engineering, Guangzhou Huali College, Guangzhou, 511300, PR China.

Heliyon
|April 1, 2024
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概括

铜微层的银膜修饰使低温Cu-Cu接成为可能. 这种方法减少了热应力和信号延迟,通过纳米圆联锁和银色缓冲层增强了关节强度.

关键词:
铜微米层是一个铜微米层.电子包装 电子包装低温接的低温接方式金属材料是金属材料.银色片的银色片.接强度的接强度是什么

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科学领域:

  • 材料科学 材料科学 材料科学
  • 纳米技术纳米技术
  • 连接技术 连接技术

背景情况:

  • 传统的复合铜 (Cu) 面临着高温的挑战,导致热应力和信号延迟.
  • 现有的Cu-Cu接方法需要高温,这限制了它们在敏感电子元件中的应用.
  • 需要先进的接技术,以确保高关节强度,同时最大限度地减少热冲击.

研究的目的:

  • 开发一种使用银 (Ag) 薄膜修饰的低温Cu-Cu接工艺.
  • 为了研究Ag修饰的Cu微层连接的微结构演变和机械特性.
  • 为了解决电子包装中高温接的局限性.

主要方法:

  • 铜微层通过电沉积通过银膜进行修改,创建纳米形突出.
  • 在特定的压力和低温条件下使用修改的Cu-Cu对进行了接.
  • 扫描电子显微镜 (SEM),传输电子显微镜 (TEM) 和剪切测试分析了关节形态和强度.

主要成果:

  • 最佳的合参数 (220°C,20 MPa,20 分钟) 导致相互锁定的纳米形Cu投射和银色缓冲层.
  • Ag膜有效地连接了Cu层,显著增加了接头的平均剪切强度.
  • 由于独特的Cu微层形态和Ag层的纳米尺寸效应,可以实现低温接.

结论:

  • 银膜修改为低温Cu-Cu接提供了一种有效的途径,具有增强的关节强度.
  • 开发的方法克服了高温接的缺点,提供了良好的接口质量和小型化潜力.
  • 这种技术对于需要高可靠性和热管理的先进电子包装应用具有前景.