展示了低损耗,高度稳定和可重复使用的边缘合器,以实现高预告效率和低g(2)(0) SOI相关的光子对源
Optics express
|April 4, 2024
概括
我们开发了一种稳定,低损耗的方法,用于将在绝缘体上的光子芯片的光线合到光纤上,使用一个渐变的波导和小核心光纤. 这种技术为光子集成提供了高稳定性和最小的合损失.
科学领域:
- 光子学和光学工程 光子学和光学工程
- 材料科学 材料科学 材料科学
- 量子信息科学 量子信息科学
背景情况:
- 在集成光子设备中,在绝缘体 (SOI) 光子芯片和光纤之间的高效光合至关重要.
- 现有的合方法经常遭受高损耗,不稳定性或复杂的制造过程.
- 尽量减少合损失和最大限度地提高稳定性是推动光子芯片技术的关键挑战.
研究的目的:
- 报告一种新的,稳定的,低损耗的方法,用于将SOI光子芯片的光合到光纤中.
- 为了简化芯片上合结构的制造过程.
- 在量子信息应用中证明这种合方法的有效性.
主要方法:
- 采用芯片上的渐变波导,将其单体集成到SOI芯片上.
- 使用一个切割的小核心光纤 (UHNA7),与标准的SMF-28光纤拼接.
- 芯片边缘和纤维端的直接接,没有粘合剂,依靠表面摩擦进行对齐.
主要成果:
- 实现了 -0.64 dB的整体合损失.
- 经过证明,在没有粘合剂的情况下,在十天内波动±0.1dB的异常稳定性.
- 尽量减少拉曼噪声产生潜力.
- 应用于相关的光子对源,每秒达到121万次计数和21.3%的预示效率.
- 获得了低至0.0004.0的第二阶自相关函数g((2)(0).
结论:
- 开发的技术为SOI光子芯片-光纤合提供了稳定,低损耗和制造友好的解决方案.
- 这种方法在稳定性和降噪方面显著改善了现有的合策略.
- 在量子源中成功应用突出了其在高性能光子集成电路和量子技术方面的潜力.
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