一种高铜度的铜-四方体复杂无电解决方案,用于芯片结合应用
Jeng-Hau Huang1, Po-Shao Shih1, Vengudusamy Renganathan1
1Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan.
Materials (Basel, Switzerland)
|April 13, 2024
概括
研究人员开发了一种用于半导体芯片包装的新铜法. 这种技术加快了粘合过程,使高效,高密度互连的批量生产成为可能.
科学领域:
- 半导体制造业 半导体制造业
- 材料科学是一种材料科学.
- 化学工程是化学工程的组成部分.
背景情况:
- 微流体无电连接在芯片包装中提供了低温,低压粘合的潜力.
- 目前的微流体方法太复杂,耗时,无法进行大规模生产.
研究的目的:
- 为半导体芯片包装开发一种新的,可批量生产的粘合方法.
- 通过缩小高密度和3D堆叠互连,提高效率和性能.
主要方法:
- 开发了一种定制的金解决方案,提高了铜度和金速度.
- 塔古奇的方法被用来优化铜-四方体复合溶液,金率和分解时间.
- 该过程消除了对流体运动的需求,缩短了生产时间.
主要成果:
- 优化的溶液具有传统溶液铜度的五倍以上.
- 在Cu层基板上实现了22.2μm/h的涂层速度和8分钟的分解时间.
- 在35°C的7分钟内成功结合铜 (Cu) 柱,在平面化后结合率为99%.
- 通过机械剪切测试证明了76 MPa的显著断裂强度.
结论:
- 拟议的涂层方法适用于半导体互连的批量生产.
- 这种技术显著提高了芯片包装的粘合效率和速度.
- 该方法实现了高级包装应用的高粘合成功率和机械强度.
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