增材制造的格结构的热传递特性与相变材料相结合
Immanuel Voigt1, Rico Schmerler2, Hannes Korn2
1Professorship Adaptronics and Lightweight Design, TU Chemnitz, Reichenhainer Straße 70, 09126 Chemnitz, Germany.
Materials (Basel, Switzerland)
|April 13, 2024
概括
隐性储热提供了更高的能量密度,但其热导率较低. 这项研究使用激光粉床聚变制造了晶格结构,以增强相变材料中的热传递.
科学领域:
- 材料科学与工程 材料科学与工程
- 热能储存 热能储存是一种热能储存.
- 增材制造 增材制造 增材制造
背景情况:
- 由于相位转换,隐性热储提供了比感性热储更高的能量密度.
- 变相材料 (PCM) 受到低导热率的阻碍,限制了传热效率.
- 将PCM与金属矩阵集成是克服低导热性的关键策略.
研究的目的:
- 通过激光粉床融合制造格结构,以提高潜热储存中的热导率.
- 为了研究不同细胞大小和支柱直径对格子几何和热性质的影响.
- 通过实验测量和数值模拟制造结构的导热率.
主要方法:
- 使用激光粉床融合 (L-PBF) 创建晶格结构的增材制造.
- 在制造过程中,格子参数 (细胞大小,支柱直径) 的系统变化.
- 过渡平面源 (TPS) 方法用于实验导热度测量.
- 有限元模拟用于分析制造和测量不确定性.
主要成果:
- 成功制造出具有热导率从3W/m·K到130W/m·K的晶格结构.
- 证明了格子几何学 (细胞大小,支架直径) 和由此产生的导热率之间的相关性.
- 有限元模拟提供了良好的估计,验证了实验数据,并考虑了不确定性.
结论:
- 增材制造的金属格子结构有效提高相变材料的导热性.
- 激光粉床融合提供了一种可行的方法,用于为热能存储应用程序创建定制的格子几何形状.
- 实验测量和数值模拟的结合提供了一个强大的方法来表征热性能.
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